发明名称 |
METHOD AND APPARATUS FOR REPAIRING AN ELECTROSTATIC CHUCK DEVICE, AND THE ELECTROSTATIC CHUCK DEVICE |
摘要 |
<p>PURPOSE: An electrostatic chuck device and a method for repairing the same are provided to prevent the non-uniformity of thermal conductive of an adhesive layer after a repairing process by uniformly repairing the eroded absorbing layer and adhesive layer. CONSTITUTION: A wafer is absorbed on the upper side of an absorbing layer(23). The absorbing layer is made of an insulation resin sheet and ceramic with an electrode. A rotation unit(11) rotates an electrostatic chuck device(20). A bobbin(12) supplies a string type adhesive(14) to an adhesive layer(22). A position determining unit determines the position of the adhesive between a bobbin and the adhesive layer.</p> |
申请公布号 |
KR20100083742(A) |
申请公布日期 |
2010.07.22 |
申请号 |
KR20100003242 |
申请日期 |
2010.01.13 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
YOSHIOKA KEN;TAKAHASHI SYUICHI;SASAKI YASUHARU |
分类号 |
H01L21/687;H02N13/00 |
主分类号 |
H01L21/687 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|