发明名称 METHOD AND APPARATUS FOR REPAIRING AN ELECTROSTATIC CHUCK DEVICE, AND THE ELECTROSTATIC CHUCK DEVICE
摘要 <p>PURPOSE: An electrostatic chuck device and a method for repairing the same are provided to prevent the non-uniformity of thermal conductive of an adhesive layer after a repairing process by uniformly repairing the eroded absorbing layer and adhesive layer. CONSTITUTION: A wafer is absorbed on the upper side of an absorbing layer(23). The absorbing layer is made of an insulation resin sheet and ceramic with an electrode. A rotation unit(11) rotates an electrostatic chuck device(20). A bobbin(12) supplies a string type adhesive(14) to an adhesive layer(22). A position determining unit determines the position of the adhesive between a bobbin and the adhesive layer.</p>
申请公布号 KR20100083742(A) 申请公布日期 2010.07.22
申请号 KR20100003242 申请日期 2010.01.13
申请人 TOKYO ELECTRON LIMITED 发明人 YOSHIOKA KEN;TAKAHASHI SYUICHI;SASAKI YASUHARU
分类号 H01L21/687;H02N13/00 主分类号 H01L21/687
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