发明名称 |
LIGHT EMITTING DIODE PACKAGE |
摘要 |
PURPOSE: A light emitting diode package is provided to maintain a wanted optical profile regardless of the size of a light emitting diode by using a lens to control the width of a flat part. CONSTITUTION: A lead frame(20) comprises a receiving unit(24) and a reflective surface(26) around the receiving unit. A light emitting diode chip(30) is received in the lead frame. A lens(40) is located on the upper side of the light emitting diode chip. A flat part(44) and a curved part formed around the flat part are prepared. The width of the light emitting diode chip is wider than the width of the flat part of the lens.
|
申请公布号 |
KR20100083538(A) |
申请公布日期 |
2010.07.22 |
申请号 |
KR20090002977 |
申请日期 |
2009.01.14 |
申请人 |
LUMENS CO., LTD. |
发明人 |
YOO, TAE KYUNG;GONG, MYEONG KOOK;LEE, JUNG HYUN;OH, SEUNG HYUN |
分类号 |
H01L33/58 |
主分类号 |
H01L33/58 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|