发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 PURPOSE: A light emitting diode package is provided to maintain a wanted optical profile regardless of the size of a light emitting diode by using a lens to control the width of a flat part. CONSTITUTION: A lead frame(20) comprises a receiving unit(24) and a reflective surface(26) around the receiving unit. A light emitting diode chip(30) is received in the lead frame. A lens(40) is located on the upper side of the light emitting diode chip. A flat part(44) and a curved part formed around the flat part are prepared. The width of the light emitting diode chip is wider than the width of the flat part of the lens.
申请公布号 KR20100083538(A) 申请公布日期 2010.07.22
申请号 KR20090002977 申请日期 2009.01.14
申请人 LUMENS CO., LTD. 发明人 YOO, TAE KYUNG;GONG, MYEONG KOOK;LEE, JUNG HYUN;OH, SEUNG HYUN
分类号 H01L33/58 主分类号 H01L33/58
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