| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition which is excellent, when developing, in adhesion with the surfaces of substrates comprising inorganic substances not containing Si atoms and the element surfaces during the patterning process. <P>SOLUTION: The negative photosensitive resin composition contains (A) a polymer having a carboxyl group and/or a phenol hydroxyl group and a unsaturated ethylenic double-bond group, (B) a photo radical polymerization initiator, and (C) a compound including three or more unsaturated carboxylate ester residues containing a hydroxyl group within a molecule. <P>COPYRIGHT: (C)2010,JPO&INPIT |
