ADHESIVE TAPE AND METHOD OF MANUFACTURING LAMINATE INCLUDING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive tape that does not contain silicone and can be manufactured at a relatively low cost.

SOLUTION: A method of manufacturing a laminate that includes a carrier substrate for a printed circuit board and an adhesive tape for temporarily fixing a printed circuit board to the carrier substrate includes: forming a first adhesive layer containing a specific copolymer obtained by copolymerizing monomers containing a (meth)acrylic acid and a glycidyl (meth)acrylate; forming a second adhesive layer containing a specific copolymer obtained by copolymerizing monomers containing a (meth)acrylic acid and a glycidyl (meth)acrylate; forming an adhesive tape that includes the first adhesive layer and the second adhesive layer as the most outer layers; laminating the second adhesive layer of the adhesive tape to the carrier substrate, with the first adhesive layer of the adhesive tape being the most upper layer; and crosslinking the second adhesive layer and the first adhesive layer on the carrier substrate. The adhesive tape is a multilayer adhesive tape or a double-sided adhesive tape.

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