| 摘要 |
PROBLEM TO BE SOLVED: To provide an alignment device that can accurately perform positioning without damaging wafer patterns, and that has a simple structure and can be manufactured at low cost. SOLUTION: The wafer W includes a reinforcing portion made of an annular projection, along an outer-periphery section. A pattern surface formed inside the reinforcing section of the wafer W faces downward and is placed on a holding stage 1, which includes a wafer placement surface, in a size not less than the external form of the wafer W. A plurality of guide pins 3 are allowed to enter each cutout 7 formed at the reinforcement section for centering. After that, a photosensor 2 detects the positioning section provided at the outer periphery of the wafer W, while the holding stage 1 is made to rotate, in a state where the reinforcing section of the wafer W is sucked and held. COPYRIGHT: (C)2010,JPO&INPIT |
