发明名称 |
DEFECT INSPECTION METHOD AND APPARATUS |
摘要 |
A pattern inspection apparatus is provided to compare images of regions, corresponding to each other, of patterns that are formed so as to be identical and judge that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.
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申请公布号 |
US2010182602(A1) |
申请公布日期 |
2010.07.22 |
申请号 |
US20090647246 |
申请日期 |
2009.12.24 |
申请人 |
URANO YUTA;HAMAMATSU AKIRA;MAEDA SHUNJI;SAKAI KAORU |
发明人 |
URANO YUTA;HAMAMATSU AKIRA;MAEDA SHUNJI;SAKAI KAORU |
分类号 |
G01N21/88;G01J4/00 |
主分类号 |
G01N21/88 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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