POLYMER OPTICAL INTERCONNECT COMPONENT

摘要

The invention relates to a polymer optical interconnect (POI) component comprising a light transmittable part with thickness of at most 3 mm and having a light transmittance of at least 60 %, measured by the method according to ASTM D1003A, wherein the POI component consists of a thermoplastic polymer composition having a melting temperature (Tm-C) of at least 260 °C and a melting enthalpy of at least 20 J/g, wherein the thermoplastic polymer composition comprises polymeric material comprising a semi-crystalline semi-aromatic polyamide (A) in an amount of at least 50 wt.% and having a melting temperature (Tm-A) of at least 260 °C, wherein the amount in wt.% and the melting enthalpy in J/g are relative to the total weight of the polymeric material.