发明名称 |
CONDUCTOR HAVING RESISTANCE LAYER FOR PRINTED CIRCUIT BOARD, FABRICATION METHOD THEREOF AND PRINTED CIRCUIT BOARD INCLUDING THE SAME |
摘要 |
PURPOSE: A PCB(Printed Circuit Board) board conductor with a built-in resistive layer and a manufacturing method thereof are provided to improve the tensile force of the conductor with the built-in resistive layer by including a resistive layer between an electrolytic copper foil and a silane coupling layer of amine series or epoxy series. CONSTITUTION: An electrolytic copper foil is prepared(S100). The resistive material is deposited on the electrolytic copper foil using a vacuum sputter(S110). A silane coupling layer is formed on a resistive layer using the silane coupling agent(S120). A conductor with a resistive layer is formed by bonding the silane coupling layer with a base substrate(S130). A circuit wiring is formed by patterning the electrolytic copper foil(S140).
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申请公布号 |
KR20100083563(A) |
申请公布日期 |
2010.07.22 |
申请号 |
KR20090003010 |
申请日期 |
2009.01.14 |
申请人 |
LS MTRON LTD. |
发明人 |
KIM, JEONG IK;KIM, SANG GYUM;CHAE, YOUNG WOOK;KIM, KYUNG LOCK;HAN, HEUNG NAM |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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