发明名称 PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD USING THE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent tent strength and sufficient photosensitivity, resolution, adhesiveness and stripping characteristics. <P>SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one ethylenically unsaturated bond in the molecule, and (C) a photopolymerization initiator, wherein the component (B) contains (B1) a compound expressed by general formula (I) and (B2) a compound having two ethylenically unsaturated groups and an oxyethylene group and/or oxypropylene group, in the molecule. In general formula (I), R<SP>1</SP>represents a hydrogen atom or a methyl group. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010160417(A) 申请公布日期 2010.07.22
申请号 JP20090003745 申请日期 2009.01.09
申请人 HITACHI CHEM CO LTD 发明人 FUKAYA TAKEHIRO;KUBOTA MASAO
分类号 G03F7/027;C08K5/10;C08L101/08;G03F7/004;G03F7/029;G03F7/033;G03F7/40;H05K3/06;H05K3/18 主分类号 G03F7/027
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