发明名称 METHOD OF FORMING CONDUCTIVE CIRCUIT, AND CONDUCTIVE CIRCUIT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming a conductive circuit that actualizes sufficient conductivity, simple processes, cost reduction, and a sufficient circuit forming speed, and to provide a conductive circuit device. Ž<P>SOLUTION: In the method of forming the conductive circuit by printing a wiring pattern on a substrate and irradiating the wiring pattern with light, a conductive material containing particulates of ≤20 nm in mean particle diameter is used to print the wiring pattern, an irradiation optical system which irradiates the wiring pattern with the light includes a light generation optical system which generates the light and a shaping optical system which shapes an irradiation pattern of the light into a belt-like shape, and the irradiation pattern of the light emitted by the irradiation optical system is moved relatively to the substrate so that the wiring pattern passes the light, thereby irradiating the wiring pattern printed on the substrate with light to the wiring pattern overall width. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010161251(A) 申请公布日期 2010.07.22
申请号 JP20090003133 申请日期 2009.01.09
申请人 HITACHI CABLE LTD 发明人 TSUCHIYA TADAITSU
分类号 H05K3/12 主分类号 H05K3/12
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