| 摘要 |
An injection molding apparatus having a sealing arrangement between a hot runner manifold and edge-gated nozzle that accommodates thermal expansion during operation is disclosed. A spacer element is axially fixed in position between the manifold and a mold plate in which the nozzle sits. The nozzle includes a reduced diameter spigot portion on an upstream end that is in a telescopic/slidable relationship with a bore of the spacer element. The nozzle includes radially extended nozzle tips axially fixed in position at a downstream end of the nozzle that are in fluid communication with respective mold gates and corresponding mold cavities. In the cold condition, a gap G exists between a shoulder of the nozzle proximate the spigot portion and a corresponding surface of the spacer element bore. Under operating conditions, thermal expansion of the nozzle is accommodated in a direction of the manifold by the gap.
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