METHOD OF CLEANING SEMICONDUCTOR WAFERS

摘要

PURPOSE: A method for cleaning a semiconductor wafer is provided to clean ground particles and organic materials on the surface of the semiconductor wafer using an acidic cleaner and an alkaline cleaner. CONSTITUTION: An aqueous acidic composition including one or more acids selected from polycarboxylic acid and inorganic acid is applied to a semiconductor wafer. An aqueous alkaline composition including one or more alkaline compound is applied to the semiconductor wafer in order to clean metal and residue. A second acidic composition including one or more acids selected from the polycarboxylic acid and the inorganic acid is applied to the semiconductor wafer. One or more surfactant is included in the aqueous acidic composition and the aqueous alkaline composition.