| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of wire displacement by connecting a semiconductor element and conductor terminals without increasing a bonding wire length even when a package size increases and multiple rows/pins are required. SOLUTION: A semiconductor device 11 in which a semiconductor element 8 is disposed, multiple conductor terminals 6 are arranged in an array around the area surrounding the semiconductor element 8, the conductor terminal 6 having a wire bonding portion on the front side and an external connection terminal on the back side, the wire bonding portions and the semiconductor element 8 are connected via bonding wires 9, and the semiconductor element 8, the bonding wires 9, and substantially the front-side halves of the conductor terminals 6 are resin sealed with sealing resin 10, wherein relay terminals 7 for connecting the semiconductor element 8 and the conductor terminals 6 via the bonding wires 9 are arranged around the area surrounding the semiconductor element 8. COPYRIGHT: (C)2010,JPO&INPIT
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