发明名称 |
Thermally Induced Single-Use Valves and Method of Use |
摘要 |
In accordance with an embodiment of the present invention, a thermally induced single-use valve is provided including a silicon wafer having a top surface and a bottom surface and at least one cavity formed in the bottom surface of the wafer, a thermally deformable membrane suspended across the cavity on the top surface of the wafer and at least one resistive element patterned on top of the thermally deformable membrane.
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申请公布号 |
US2010180953(A1) |
申请公布日期 |
2010.07.22 |
申请号 |
US20070734090 |
申请日期 |
2007.04.11 |
申请人 |
UNIVERSITY OF SOUTH FLORIDA |
发明人 |
CARDENAS-VALENCIA ANDRES M.;DLUTOWSKI JAY;CARDENAS MICHELLE;BUMGARNER JOHN;WANG WEIDONG;LANGEBRAKE LARRY |
分类号 |
F16K17/14 |
主分类号 |
F16K17/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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