| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such problems that, when a surface of a bump electrode is flat, if the needle gap of a probe card is caused, a needle slides down and is detached from a bump electrode, the needle of the probe card hits portions except the bump electrode, scratch is generated on pattern, and failure is generated. <P>SOLUTION: Convexoconcave is formed in the surface of the bump electrode. For the purpose, a slit part is provided beforehand in a bonding pad part of an aluminum layer, and an HDP interlayer oxide film and an SiON film or an SiN film is grown on the slit part. Furthermore, the bump electrode is formed on the film. At this time, convexoconcave is inherited in each layer above the slit. By putting the needle of the probe card on a concave portion in the surface of the bump electrode, the needle gap can be prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT |
