| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a means for reducing an area required for an imaging operation which is performed before imaging, thereby downsizing a device as a whole in a probe device which loads a substrate on a loading table, and brings a probe needle of a probe card into contact with an electrode pad of the substrate to measure an electrical characteristic of a chip. Ž<P>SOLUTION: This probe device has a lower imaging part 40 provided in a side part of a wafer chuck, an upper imaging part 50 for imaging a wafer on the wafer chuck at a position overlapping with a moving area of a stage unit upon probe card imaging, and a moving mechanism for moving the upper imaging part 50 between a position when the wafer is imaged and a recess part 29 serving as an evacuating area formed on the upper side of the moving area of the stage unit and at a position off from the probe card in a head plate. The evacuating area of the upper imaging part 50 is deleted from on an X-Y plane of a case 22 to make the case 22 small, thereby downsizing the probe device. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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