| 摘要 |
Intended is to suppress the separation by a thermal stress between an upper substrate and a lower substrate jointed through a joint member, and to suppress a creeping discharge from an upper electrode to a lower electrode. An active matrix substrate and a glass substrate are jointed at their outer peripheral portions so that the joint area, in which the active matrix substrate and the glass substrate are jointed, can be reduced. This makes it possible to reduce the thermal stress to be caused between the active matrix substrate and the glass substrate, and to suppress the separation between the active matrix substrate and the glass substrate jointed with an adhesive resin. Moreover, a semiconductor layer is covered at its peripheral end portion with the adhesive resin, so that a creeping discharge, as might otherwise occur from a bias electrode to a charge collecting electrode, can be suppressed through a clearance even if the clearance is created between the peripheral end portion of the semiconductor layer and the active matrix substrate.
|
