发明名称 COATING FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a coating film forming method for obtaining a hard coating layer having characteristics excellent in adhesiveness to a substrate and in adhesiveness between different layers of a coating film, and a coated member coated by the coating film forming method. SOLUTION: The coating film forming method comprises a bombardment step of executing the bombardment treatment on at least a surface of the substrate by using a physical vapor deposition apparatus in which a plurality of cathodic substances are attached to a plurality of evaporation sources, a blocking plate is provided on a front side of each of the evaporation sources, plasma is generated in a decompression container to form a film of a cathodic substance material on the surface of the substrate, and a coating step of forming the film. In the bombardment step, impurity components remaining in the substrate and the decompression container are adsorbed by the blocking plate together with the discharged substance by executing the bombardment treatment of the substrate by at least non-metallic ions in a state where the discharged substance by the discharge of the evaporation source is blocked from the substrate by the blocking plate. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010159498(A) 申请公布日期 2010.07.22
申请号 JP20100078066 申请日期 2010.03.30
申请人 HITACHI TOOL ENGINEERING LTD 发明人 ISHIKAWA TAKASHI
分类号 C23C14/54;B23B27/14;C23C14/24 主分类号 C23C14/54
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