| 摘要 |
<P>PROBLEM TO BE SOLVED: To joint and fix a base, a cover and a heat pipe to attain high heat radiation effect by a jointing structure that does not use tin for soldering. Ž<P>SOLUTION: The heat radiating structure 2 includes a base 21 wherein lower fitting grooves 211 are formed within a plane, in contact with heat pipes 22; a plurality of heat pipes 22 whose lower halves are fitted into the grooves; and a cover 23, where upper fitting grooves 231 to fit the upper halves of the heat pipes are formed. A thermal conductive substance is interposed and fixed between the heat pipes and the fitting grooves, and a plurality of heat radiating fins 24 are provided on the cover 23 so that heat from an electronic device, in contact with the lower plane of the base, is conducted effectively. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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