An RF/EMI shield has a planar conductive element and a plurality of solder spheres extending around the edges making electrical and mechanical contact with the conductive element to form a shield which can be soldered in a surface mount process directly over components needing shielding. The solder spheres have a diameter sufficient to provide the desired clearance between the shielding element and the component being shielded and a melting temperature equivalent to existing solder contacts to which the shield is bonded.
申请公布号
US2010182765(A1)
申请公布日期
2010.07.22
申请号
US20090356812
申请日期
2009.01.21
申请人
DELPHI TECHNOLOGIES, INC.
发明人
VADAS ROBERT L.;ELDON TIMOTHY ARTHUR;POST SCOTT E.;GILBERTSON KURT ERIC