ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE

摘要

Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings (401, 403) in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die (169). A layered redistribution structure is formed on one side of the encapsulated structure.