| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a material for efficiently forming a precise solder wicking prevention zone having a width of 1 mm or less and a width variation of about 0.1 mm, which prevents the solder from wetting and spreading on a contact part when applying molten solder to an electronic component having the contact part in contact with a terminal part to be soldered. SOLUTION: The solder wicking prevention zone is formed by a cured coating film 62 of a photocurable forming material 61 capable of being ejected from an inkjet head, and an adhesion improving agent 51 containing a silane coupling agent capable of being ejected from the inkjet head is coated on a position forming the solder wicking prevention zone before the photocurable forming material 61 is coated thereon. COPYRIGHT: (C)2010,JPO&INPIT |
