WAFER SUPPORT ADHESIVE FILM FOR PROCESSING IN SEMICONDUCTOR THIN FILM WAFER FABRICATION

摘要

PURPOSE: A wafer support adhesive film for processing a semiconductor thin film wafer is provided to prevent the damage to a semiconductor wafer by not requiring an additional cleaning process in a separation process. CONSTITUTION: An adhesive film is attached to a circuit formation surface of a semiconductor wafer(W) by using a laminator(16). The semiconductor wafer is thinned by grinding the rear of the semiconductor wafer with a grinder(10). The rear of the semiconductor wafer is fixed to a dicing tape(11). The dicing tape has adhesion and is maintained in a frame(12).