发明名称 |
EPITAXIALLY COATED SILICON WAFER AND METHOD FOR PRODUCING EPITAXIALLY COATED SILICON WAFER |
摘要 |
PURPOSE: An epitaxial coating silicon wafer with an improved plane figure and a method for manufacturing the same are provided to manufacture a silicon wafer with the overall plane figure of 0.02 to 0.06 um. CONSTITUTION: A plurality of wafers whose surface is polished is prepared. A plurality of wafers is successively coated in an epitaxial reactor. The plurality of wafers is arranged in a susceptor inside the epitaxial reactor one by one. The plurality of wafers is pre-processed under the hydrogen atmosphere. The surface of the polished wafer is epitaxially coated.
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申请公布号 |
KR20100083713(A) |
申请公布日期 |
2010.07.22 |
申请号 |
KR20100001179 |
申请日期 |
2010.01.07 |
申请人 |
SILTRONIC AG |
发明人 |
HABERECHT JOERG;HAGER CHRISTIAN;BRENNINGER GERORG |
分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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