发明名称 PLATE APPARATUS OF PLACING A SUBSTRATE
摘要 PURPOSE: A substrate supporting device is provided to uniformly form a thin film on a substrate by differently making plasma density according to a process speed. CONSTITUTION: A holding unit(11) comprises one side to hold a substrate(10) for an electronic component. A high frequency electrode(13) is installed inside the holding unit. The high frequency is provided around the holding unit to generate plasma. A dielectric(15) is positioned to have different thickness on at least one of one side of the holding unit and the high frequency electrode. The dielectric becomes thin from the outer part to the central part of the holing unit.
申请公布号 KR20100083471(A) 申请公布日期 2010.07.22
申请号 KR20090002858 申请日期 2009.01.14
申请人 KOMICO LTD. 发明人 LEE, SEONG MIN;CHOI, JEONG DUCK;CHOI, JIN SIK
分类号 H01L21/683;H01L21/687 主分类号 H01L21/683
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