| 摘要 |
The present invention provides a high frequency module having a base substrate unit ( 2 ) which has its uppermost layer planarized to form a buildup-forming surface ( 16 ), a high frequency circuit unit ( 3 ) having multiple wiring layers which are formed on the base substrate unit ( 2 ), each of which layers has a wiring pattern and film elements formed on a dielectric insulating layer thereof, whose uppermost wiring layer ( 17 ) has plural lands ( 22 ) and ground patterns ( 20 ) formed thereon together with the wiring pattern and inductor elements ( 19 ), and a semiconductor chip ( 4 ) mounted on the wiring layer ( 17 ) of the high frequency circuit unit ( 3 ). Transmission lines ( 24 ) to connect the inductor elements ( 19 ) and lands ( 22 ) which are formed on the wiring layer ( 17 ) are directed within hollowed pattern regions ( 20 c) formed at the ground pattern ( 20 ) to constitute coplanar type transmission lines. |
