发明名称 |
Compositions and processes for photolithography |
摘要 |
New photoresist compositions are provided that are useful for immersion lithography. In one preferred aspect, photoresist composition are provided that comprise: (i) one or more resins that comprise photoacid-labile groups, (ii) a photoactive component, and (iii) one or more materials that comprise photoacid labile groups and that are distinct from the one or more resins; wherein the deprotection activation energy of photoacid-labile groups of the one or more materials is about the same as or lower than the deprotection activation energy of photoacid-labile groups of the one or more resins. In another preferred aspect, photoresist compositions are provided that comprise (i) one or more resins, (ii) a photoactive component, and (iii) one or more materials that comprise a sufficient amount of acidic groups to provide a dark field dissolution rate of at least one angstrom per second. |
申请公布号 |
EP2189845(A3) |
申请公布日期 |
2010.07.21 |
申请号 |
EP20090155452 |
申请日期 |
2009.03.18 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
WANG, DEYAN;XU, CHENG-BAI;BARCLAY, GEORGE G.;WU, CHUNYI |
分类号 |
G03F7/004;G03F7/038;G03F7/039;G03F7/20 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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地址 |
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