| 摘要 |
A protection device for integrated circuits which prevents inadvertent damage caused by over-voltage power surges. The protection device comprising an insulating carrier having a ground plane thereon and a plurality of conductive pads around a periphery thereof. The plurality of conductive pads are spaced from the ground plane with a precision gap therebetween. When the protection device is placed over the integrated circuit chip, the plurality of conductive pads are coupled to the bonding pads of the integrated circuit and at least one of the conductive pads is coupled to the ground plane. |
