发明名称 ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE
摘要 A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.
申请公布号 EP2208223(A2) 申请公布日期 2010.07.21
申请号 EP20080781591 申请日期 2008.07.10
申请人 OCCAM PORTFOLIO LLC 发明人 FJELSTAD, JOSEPH C.
分类号 H05K1/18;H01L23/538 主分类号 H05K1/18
代理机构 代理人
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