| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enhance the reliability of an electronic component product in a process for manufacturing an electronic component comprising: a circuit element provided on one side of an insulating substrate 1 constituting an electronic component; a protective film 6 of the circuit element; a land 8 located at the opening of the protective film 6; and a conductive ball 7 being connected with the land 8 through a connecting member. <P>SOLUTION: The process for manufacturing an electronic component comprises following four steps to be carried out in this order: an eleventh step for forming a circuit element on one side of an insulating substrate 1 such that a thick film circuit element terminal is exposed; a twelfth step for forming a protective film 6 of the circuit element such that the circuit element terminal is exposed partially through the opening of the protective film 6; a thirteenth step for bonding the circuit element terminal and a conductive ball 7 temporarily such that high viscosity flux exists in a narrower region within the opening region; and a fourteenth step for heating the circuit element terminal and the conductive ball 7 such that the surfaces are bonded. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
