发明名称 |
PRINTED CIRCUIT BOARDS WITH STACKED MICROS VIAS |
摘要 |
A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate. |
申请公布号 |
EP2016810(A4) |
申请公布日期 |
2010.07.21 |
申请号 |
EP20070755901 |
申请日期 |
2007.04.19 |
申请人 |
DYNAMIC DETAILS, INC. |
发明人 |
KUMAR, RAJ;DREYER, MONTE;TAYLOR, MICHAEL, J. |
分类号 |
H05K1/00;B23B3/00;B32B15/08;H05K1/03;H05K1/16 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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