Electronic parts packaging structure and method of manufacturing the same

摘要

An electronic parts packaging structure of the present invention includes a wiring substrate (2) having a wiring pattern (32a), a first insulating film (36a) which is formed on the wiring substrate (2) and which has an opening portion (39) in a packaging area (A) where an electronic parts (20) is mounted, the electronic parts (20) having a connection terminal (21) flip-chip mounted on the wiring pattern (32a) exposed in the opening portion (39) of the first insulating film (36a), a second insulating film (36b) for covering the electronic parts, (20) a via hole (36x) formed in a predetermined portion of the first and second insulating films (36a,36b) on the wiring pattern (32a), and an upper wiring pattern (32b) formed on the second insulating film (36b) and connected to the wiring pattern (32a) through the via hole (36x).