Electromagnetic interference shield for semiconductors using a continuous or near-continuous peripheral conducting seal and a conducting lid

摘要

A semiconductor package structure including a conductive adhesive material which is used to form an electromagnetic interference shield-forming Faraday cage. The Faraday cage incorporates a module lid as the top surface thereof, the conductive material as the sides and a laminate ground plane(s) or substrate as its bottom. Also disclosed is a method for fabricating the foregoing semiconductor package structure.