发明名称 |
Different materials bonded member and production method thereof |
摘要 |
A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
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申请公布号 |
US7758970(B2) |
申请公布日期 |
2010.07.20 |
申请号 |
US20080104547 |
申请日期 |
2008.04.17 |
申请人 |
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发明人 |
SHINKAI MASAYUKI;ISHIKAWA TAKAHIRO;KIDA MASAHIRO |
分类号 |
B23K1/19;B32B15/04;B23K31/02;B32B18/00;C04B37/02;H01L21/68;H01L21/683 |
主分类号 |
B23K1/19 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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