Method for vacuum deposition of circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same

摘要

The invention relates to a method for vacuum deposition of circuitry onto a thermoplastic material. In one of its aspects, the invention relates to a vacuum deposition of circuitry for automotive applications. In another of its aspects, the invention relates to a vehicular lamp housing incorporating a circuit placed thereon by vacuum deposition. In another of its aspects, the invention relates to a vehicular lamp housing with vacuum deposition of circuitry powering light-emitting diodes. In another of its aspects, the invention relates to a vehicular lamp housing with a vacuum deposition of circuitry powering removable incandescent lamps.