发明名称 Method and material for forming a double exposure lithography pattern
摘要 A method of lithography patterning includes forming a first material layer on a substrate; forming a first patterned resist layer including at least one opening therein on the first material layer; forming a second material layer on the first patterned resist layer and the first material layer; forming a second patterned resist layer including at least one opening therein on the second material layer; and etching the first and second material layers uncovered by the first and second patterned resist layers.
申请公布号 US7759253(B2) 申请公布日期 2010.07.20
申请号 US20060563805 申请日期 2006.11.28
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHANG CHING-YU
分类号 H01L21/302;H01L21/461 主分类号 H01L21/302
代理机构 代理人
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