发明名称 |
Space transformer having multi-layer pad structures |
摘要 |
Pad structures and methods for forming such pad structures are provided. For the pad structure, the first conductive material layer has a first hardness over about 200 kg/mm2. The second conductive material layer is over the first conductive material layer and has a second hardness over about 80 kg/mm2. For the method of forming the pad structure, a plurality of first conductive material layers is formed within each of a plurality of openings of a substrate. The substrate has a plurality of openings therein. The first conductive material layers are formed within each of the openings of the substrate. The first conductive material layers substantially have a round top surface. The second conductive material layers are formed and substantially conformal over the first conductive material layers. The second conductive material layers cover a major portion of the round top surface of the first conductive material layers.
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申请公布号 |
US7759776(B2) |
申请公布日期 |
2010.07.20 |
申请号 |
US20060392299 |
申请日期 |
2006.03.28 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHENG HSU MING |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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