发明名称 Space transformer having multi-layer pad structures
摘要 Pad structures and methods for forming such pad structures are provided. For the pad structure, the first conductive material layer has a first hardness over about 200 kg/mm2. The second conductive material layer is over the first conductive material layer and has a second hardness over about 80 kg/mm2. For the method of forming the pad structure, a plurality of first conductive material layers is formed within each of a plurality of openings of a substrate. The substrate has a plurality of openings therein. The first conductive material layers are formed within each of the openings of the substrate. The first conductive material layers substantially have a round top surface. The second conductive material layers are formed and substantially conformal over the first conductive material layers. The second conductive material layers cover a major portion of the round top surface of the first conductive material layers.
申请公布号 US7759776(B2) 申请公布日期 2010.07.20
申请号 US20060392299 申请日期 2006.03.28
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHENG HSU MING
分类号 H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/48
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