发明名称 Manufacturing method for packaging electronic products in a band-shaped package
摘要 A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.
申请公布号 US7757464(B2) 申请公布日期 2010.07.20
申请号 US20050096091 申请日期 2005.04.01
申请人 TOSHIBA MATSUSHITA DISPLAY TECHNOLOGY CO., LTD. 发明人 HIRATA KATSUYASU;SHIMADA OSAMU;OHASHI KAZUHIRO;IIZUKA TAKAYUKI;SHINTANI HIROSHI
分类号 B65B11/50;B65D85/68;B65B9/06;B65B9/13;B65B15/04;B65B69/00;B65D73/00;B65D73/02;B65D75/42;B65D85/86;G02F1/13;H05K3/00;H05K13/00 主分类号 B65B11/50
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