发明名称 System-in-package having reduced influence between conductor and antenna and method of designing the same
摘要 The present invention relates to a SiP having reduced influence between a conductor and an antenna, and a method of designing the SiP. The SiP includes an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP, and a first planar conductor having at least one slit formed therein. Therefore, the present invention minimizes the amount of current or electromagnetic field induced on the conductor by the current or electromagnetic field of the antenna, thus reducing the influence of the conductor on the operating characteristics of the antenna.
申请公布号 US7757959(B2) 申请公布日期 2010.07.20
申请号 US20070951715 申请日期 2007.12.06
申请人 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 KIM JOUNGHO;KIM GAWON;RYU CHUNG HYUN
分类号 G06K19/06 主分类号 G06K19/06
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