发明名称 MEMORY BOARD STRUCTURE HAVING STUB RESISTOR OF MEMORY MODULE ON MAIN BOARD
摘要 PURPOSE: A memory board forming structure forming stub resistance on a main board is provided to remove the stub resistance from a memory module, thereby reducing the manufacturing cost of the memory module. CONSTITUTION: Module sockets(20,21) are loaded in a main board(10) and is electrically connected with a memory controller through a memory bus. Memory module boards(30,31) includes a plurality of memory chips and is connected to the module sockets in order to be controlled with the memory controller. Stub resistance arrays(50,51) are arranged between the module sockets in order to perform a stub resistance function about the memory module board.
申请公布号 KR20100082648(A) 申请公布日期 2010.07.19
申请号 KR20090002035 申请日期 2009.01.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, SUNG JOO;KO, KI HYUN;SUNG, MYUNG HEE;KIM, SOO KYUNG
分类号 G06F13/00;G06F1/00;G11C7/10 主分类号 G06F13/00
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