发明名称 POLISHING PAD AND METHOD OF USE
摘要 A polishing pad has one or more polishing elements made from a hydrogel material having an intrinsic ability to absorb water. The hydrogel material may or may not have micropores, but has a water absorption capability of 4%-60% by weight, a wet tensile strength greater than 1000 psi, a flexural modulus greater than 2000 psi, and a wet Shore D hardness between 25-80, inclusive. The hydrogel material may be made from one or a combination of the following moeties: urethane, alkylene oxides, esters, ethers, acrylic acids, acrylamides, amides, imides, vinylalcohols, vinylacetates, acrylates, methacrylates, sulfones, urethanes, vinylchlorides, etheretherketones, and/or carbonates.
申请公布号 KR20100082765(A) 申请公布日期 2010.07.19
申请号 KR20107006872 申请日期 2008.08.21
申请人 SEMIQUEST, INC. 发明人 BAJAJ RAJEEV
分类号 B24D3/26;B24B1/00;B24B37/04;H01L21/304 主分类号 B24D3/26
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