A PRINTED CIRCUIT BOARD AND A FABRICATING METHOD THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve the reliability of a printed circuit board by executing the function of a solder resist layer using a photosensitivity insulating material. CONSTITUTION: A printed circuit board comprises an insulating layer(106), a circuit layer(102a,108a), and an insulating material(110a,110b). The circuit layer comprises a connection pad which is impregnated to the insulating layer with surface height same as the height of the insulating layer. The circuit layer is impregnated in the insulating layer. The insulating material has an open part which exposes the connection pad. The insulating material is impregnated in the insulating layer in order to protect the circuit layer from the outside. The circuit layer comprises a first circuit layer formed in one side of the insulating layer and a second circuit layer formed in the other side of the insulating layer. The insulating layer comprises a bump(104) for connecting the first circuit layer and the second circuit layer. An external connection terminal is attached to one side of the connection pad with surface height same as the insulating layer.