| 摘要 |
A mold die for the FBGA package assembly FBGA is provided, which can prevent the incomplete mold fault of the mold compound. The mold die for the FBGA package assembly is used for the molding progress for sealing the cavity of the substrate including the bonding wire and the top of the substrate including the semiconductor chip. The upper mold(104) is arranged on the top of the substrate(108) including the semiconductor chip. The lower die(102) is arranged in the lower part of the substrate. The lower die comprises the first surface pressure part, the second surface pressure part and V-shaped groove. The first surface pressure part is adjacent to the part corresponding to the cavity of substrate. The second surface pressure part is equipped in the part corresponding to of the substrate edge. The V-shaped groove does not come contact with the substrate between the first surface pressure part and the second surface pressure part. |
