| 摘要 |
PURPOSE: A heat resistant adhesive composition is provided to have excellent adhesive force and workability, to obtain enough heat resistance when electronic parts are combined on a lead frame of a semiconductor device, and to obtain high reliability at a high temperature. CONSTITUTION: A heat resistant adhesive composition includes 1-400 parts by weight of an epoxy resin, 1-200 parts by weight of a phenolic resin, 0.01-50 parts by weight of an antioxidant, 0.01-10 parts by weight of an anticorrosive agent, 0.01-50 parts by weight of a hardener, and 0.001-10 parts by weight of a curing accelerator. The acrylonitrile butadiene rubber has the content of a carboxylic group of 0.1-10.0 weight%.
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