CMP slurry composition for polishing copper line and polishing method using the same,申请号KR20070102311-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	CMP slurry composition for polishing copper line and polishing method using the same
摘要
申请公布号	KR100970094(B1)	申请公布日期	2010.07.16
申请号	KR20070102311	申请日期	2007.10.10
申请人		发明人
分类号	C09K3/14	主分类号	C09K3/14
代理机构		代理人
主权项
地址

您可能感兴趣的专利

PHARMACEUTICAL COMPOSITIONS FOR THE TREATMENT OF TUMOURS THAT EXPRESS WGFR AND GANGLIOSIDE N-GLYCOLYL GM3(NEUGCGM3)

SURFACE TRACKING AND MOTION COMPENSATING SURGICAL TOOL SYSTEM

RESOURCE MANAGEMENT FOR CLOUD COMPUTING PLATFORMS

ARTICLE INCLUDING VISUAL SIGNAL FOR COMMUNICATION OF DEPTH PERCEPTION

PLATING APPARATUS FOR SOLAR CELL SUBSTRATE, IN WHICH ELECTROPLATING AND LIGHT-INDUCED PLATING ARE SIMULTANEOUSLY PERFORMED

SOYASAPOGENOL COMPOSITION

A COMPOSITION COMPRISING SPECIFIC LACTOBACILLUS HELVETICUS STRAINS AND REDUCING FOOD AND/OR RESPIRATORY ALLERGY SYMPTOMS

Distal tibia plating system

TRACEABLE LABELING APPARATUS FOR CONTAINERS OF BIOLOGICAL PRODUCTS

CONNECTOR FOR ABSORBER TUBES IN A CONCENTRATING SOLAR POWER PLANT

AMMUNITION MAGAZINE

Bait trap for insects

DRUG RETAINING SURFACE FEATURES IN AN IMPLANTABLE MEDICAL DEVICE

COLOR SUBSTITUTION MECHANISM

CELLULOSE BASED ELECTRICALLY INSULATING MATERIAL

METHOD AND DEVICE FOR USE IN FRAME ACKNOWLEDGEMENT

Catheter connector

METHOD, EQUIPMENT AND SYSTEM FOR ADJUSTING FEEDBACK CYCLE OF CQI

Distributed mobile access point acquisition