| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element package improved in thermal resistance of the package. <P>SOLUTION: This invention relates to this light emitting element package and a method for manufacturing the same. The light emitting element package includes: a package body including a cavity disposed at an upper portion; an insulating layer disposed on a surface of the package body; a plurality of metal layers disposed on the insulating layer; a light emitting element disposed in the cavity; and a first metal plate disposed on the undersurface of the package body corresponding to the light emitting element. <P>COPYRIGHT: (C)2010,JPO&INPIT |
