| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure capable of achieving high impedance matching on a package transmission line from a solder ball to an IC of a semiconductor device having a microstrip line structure. <P>SOLUTION: In a package GND layer 44 below a land 43 of the solder ball 42, an opening 45 is formed which has the same diameter with the land diameter and is filled with air or a substrate material, or has a diameter larger or smaller than the land diameter. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
