发明名称 Housing Comprising A Device For Fixing An Electronic Component
摘要 A housing for retaining an electronic component, including a lid and a lower part made of synthetic material, wherein the lid is joined in a force-fit manner to the lower part by clamping geometry, and in order to affix the electronic component in position, the lid applies a specified force (F) to the electronic component after being joined to the lower part due to its design. Here, the lid is designed in such a manner that the force (F) applied lies within a specified force range (B), and that the clamping geometry comprises a groove on the lower part and a ridge on the lid which grips into the groove, wherein a clamp web on the lower part or on the lid is arranged in such a manner that the lid is removably clamped to the lower part after being joined to the lower part with a force (F) which acts parallel to the clamping force (KF).
申请公布号 US2010175921(A1) 申请公布日期 2010.07.15
申请号 US20080531776 申请日期 2008.03.19
申请人 CONTI TEMIC MICROELECTRONIC GMBH 发明人 BUEYUEKBAS TURHAN;RIETSCH JUERGEN;KARRER HELMUT;HENNIGER JUERGEN;GRAMANN MATTHIAS;WIECZOREK MATTHIAS;SCHARRER KLAUS;GUTH PETER;TRODLER DIRK
分类号 H05K5/00 主分类号 H05K5/00
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