| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for resin coating, with which waviness and warp of a workpiece is appropriately removed and the ground workpiece is formed to be strictly flat as the gravity is taken into consideration. SOLUTION: A surface 1a of a wafer 1 is sucked to a sucking surface 24a of a suction part 24 of a pressing pad 23, and deformation of the wafer 1 is corrected. Then, the corrected wafer 1 is mounted on a liquefied resin P1 and pressed. Next the resin P1 is hardened after the pressing pad 23 is released from the wafer 1 to cause deformation for restoring the warp or the like on the wafer 1. A strictly flat state is obtained after grinding without permitting the deformation due to the gravity, by causing the resin P1 to deform from the corrected condition. COPYRIGHT: (C)2010,JPO&INPIT
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