发明名称 |
ELECTRONIC SHIELD ASSEMBLY AND METHODS |
摘要 |
<p>A shield assembly useful in the attenuation of electronic noise or spurious electric signals. In one embodiment, the shielding assembly comprises a metallic component that is encapsulated with an electronic component to be shielded, such as an integrated circuit. A conductive coating is applied to an exterior surface of the encapsulated metallic and electronic components so that it is in contact with the metallic component. The metallic component is formed using a selective metal deposition process (e.g., electroforming) and a laser-cutting process that increase manufacturing efficiency and provide enhanced mechanical and structural features, including especially the ability to make the shield very thin, have a high degree of co planarity, and maintain a low profile for the shielded electronic component as a whole (i.e., add very little height to that of the electronic component). Methods of manufacturing and utilizing the shielding assembly in designs are also disclosed.</p> |
申请公布号 |
WO2010080447(A1) |
申请公布日期 |
2010.07.15 |
申请号 |
WO2009US68312 |
申请日期 |
2009.12.16 |
申请人 |
AUTOSPLICE INC.;BOGURSKY, ROBERT;KRONE, KENNETH;BELLANTONI, PETER;FEIGENBAUM, HAIM |
发明人 |
BOGURSKY, ROBERT;KRONE, KENNETH;BELLANTONI, PETER;FEIGENBAUM, HAIM |
分类号 |
H05K9/00 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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